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Challenges and Opportunities IC Design and Manufacturing in Deep Nano-Scaling and Beyond
Challenges and Opportunities IC Design and Manufacturing in Deep Nano-Scaling and Beyond
教师介绍

本讲教师:潘志刚
所属学科:工科
人  气:1206

课程介绍
Integrated circuit (IC) is one of the most important inventions that have helped shape the entire information revolution. As the feature size enters the era of extreme scaling (14nm, 11nm, and beyond), IC design and manufacturing challenges are exacerbated, due to the adoption of multiple patterning and other emerging lithography technologies. Meanwhile, new ways of “equivalent” scaling such as 2.5D/3D IC have gained tremendous interest and initial industry adoption, and new devices/materials such as nanophotonics are making their headways to on-chip integration. Furthermore, IC design and CAD methodologies are being pushed to new frontiers, e.g., into bio-chips, healthcare, and Internet-of-Things, where energy and security are major concerns. This talk will discuss some key technology trends and challenges in nanometer IC design and manufacturing closure in deep nano-scaling and beyond, and discuss some opportunities and recent research results. Biography: David Z. Pan (IEEE Fellow) received his PhD degree in Computer Science from UCLA in 2000. He was a Research Staff Member at IBM T. J. Watson Research Center from 2000 to 2003. He is currently Engineering Foundation Endowed Professor (#1) at the Department of Electrical and Computer Engineering, The University of Texas at Austin. He has published over 240 refereed technical papers and 8 US patents, and graduated 20 PhD students. He has served in many journal editorial boards (TCAD, TVLSI, TCAD-I, TCAS-II, TODAES, Science China Information Science, etc.) and conference committees (DAC, ICCAD, DATE, ASPDAC, ISLPED, ISPD, etc.). He has received a number of awards, including the SRC Technical Excellence Award (2013), DAC Top 10 Author Award in Fifth Decade (2013), DAC Prolific Author Award (2013), ASP-DAC Frequently Cited Author Award (2015), 13 Best Paper Awards at premier venues, Communications of the ACM Research Highlights (2014), ACM/SIGDA Outstanding New Faculty Award (2005), NSF CAREER Award (2007), NSFC Overseas and Hong Kong/Macau Scholars Collaborative Research Award, SRC Inventor Recognition Award three times, IBM Faculty Award four times, UCLA Engineering Distinguished Young Alumnus Award (2009), UT Austin RAISE Faculty Excellence Award, many international CAD contest awards, among others. 潘志刚(David Z. Pan) 博士,IEEE Fellow, 美国德克萨斯大学奥斯汀分校(UT Austin)电子与计算机工程系终身讲席教授 (Engineering Foundation Professor)。1992年获北京大学地球物理系学士学位, 1994/1998/2000年分别获得加州大学洛杉矶分校(UCLA)大气科学硕士/计算机科学硕士/计算机科学博士学位(获优秀博士奖)。他2000-2003年任美国IBM研究中心研究员。2003年至今执教于UT Austin, 任集成电路设计及自动化实验室主任。在他指导下已有20位博士生毕业。 在他领域的顶级学术期刊和会议发表论文超过240多篇,拥有8项美国专利。 他的科研成果不仅在学术界被广泛引用,还大量实际应用于工业界。他担任许多顶尖期刊的编委,众多国际会议及学会的主席,并担任过许多国际知名公司的顾问或主持合作项目。他被选为2012-2014年度UT Austin亚裔教授员工协会主席。他荣获过30多个国际重要奖项,包括:世界顶尖的半导体研究联盟Semiconductor Research Corporation (SRC) 2013年度杰出研究大奖的唯一得主;数次荣获电子设计自动化领域国际顶级会议的顶级作者奖/频繁引用作者奖; 13次荣获最佳论文奖;美国 NSF CAREER Award; 中国自然科学基金海外及港澳学者合作研究基金 (即海外杰青);加州大学洛杉矶分校工学院杰出年青校友奖; 四次获得IBM教授奖;德州大学奥斯汀分校杰出亚裔教授奖,等等。

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